ROTAX 897-186 HEAT CONDUCTION COMPOUND
Categorías: ROTAX ACCESSORIES AND SUPPLIES, Selladores y Grasas
MFR Model# 897-186
226.16$ + IVA
Overview
| Wacker Silicone Paste P 12 is used especially in semiconductor technology as a heat sink paste. Wherever it is important to have good heat transfer from a semiconductor to a cooling element, it is advisable to have a thin coating of Wacker Silicone Paste P 12. In the assembly of semiconductors, e.g. diodes, transistors and thyristors, microcopic elevations exist on the mating surfaces of the semiconductor and the cooling surface if they have not been ground and polished. When these surfaces are placed together, a firm metal- to-metal contact will result only where there are these elevations. 40 – 60 % of the surface is thus not in direct contact, depending on the roughness. This means that the hollow spaces in between these elevations are filled with air, which has relatively poor thermal conductivity.
By coating the contact surfaces with Wacker Silicone Paste P 12, the thermally insulating air is replaced by the heat sink silicone paste when the semiconductor is screwed on. The thermal conductivity of Wacker Silicone Paste P 12 is about 20 times better than that of air. Practical experience has shown that by using Wacker Silicone Paste P 12, the heat transfer resistance from the semi-conductor housing to the cooling elements is reduced to half. Wacker Silicone Paste P 12 can be applied with a brush, spatula or by screen printing. Best results are achieved when a uniform, thin coat is applied to the mating surfaces. Paste squeezed out when the semiconductor is screwed on should be removed. |
