TANIS SOLVENT WIPE

Categorías: ,

Part# 05-14711

7.13$ + IVA

Overview

Solvent Wipe

Used for prep of surface for pad heat element bonding and click bond bonding.

Specifications

  • n-Heptane, 142-82-5
  • Acetone, 67-64-1
  • Methyl Cyclohexane, 108-87-2
  • p-Amyl Acetate, 628-63-7

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